{"id":228080,"date":"2024-04-25T09:42:03","date_gmt":"2024-04-25T09:42:03","guid":{"rendered":"https:\/\/www.techopedia.com\/?post_type=news&p=228080"},"modified":"2024-04-25T09:42:03","modified_gmt":"2024-04-25T09:42:03","slug":"nvidia-supplier-sk-hynix-sees-record-revenue-fueled-by-ai-boom","status":"publish","type":"news","link":"https:\/\/www.techopedia.com\/news\/nvidia-supplier-sk-hynix-sees-record-revenue-fueled-by-ai-boom","title":{"rendered":"Nvidia Supplier SK Hynix Sees Record Revenue Fueled by AI Boom"},"content":{"rendered":"
As large AI models are on the rise, the same is Nvidia’s supplier, SK Hynix. The company has just reported its best quarter.<\/strong><\/p>\n SK Hynix, the South Korean memory chipmaker<\/a>, announced<\/a> a dramatic financial turnaround. After suffering losses for five consecutive quarters, its first-quarter net profit comprised 1.92 trillion South Korean won ($1.39 billion).<\/span><\/p>\n This rebound is primarily attributed to a surge in sales of AI server products, particularly those utilizing its high-bandwidth memory technology. It has been critical in meeting the increasing demands of AI chipsets used by companies like Nvidia<\/a>.<\/span><\/p>\n The company’s revenue reached 12.43 trillion won, marking a 144% increase from the previous year and the highest since the second quarter of 2022.<\/span><\/p>\n This financial recovery is spurred by the booming AI sector, including large language models like ChatGPT<\/a>, which require extensive memory capabilities that SK Hynix’s products provide.<\/span><\/p>\n SK Hynix plans significant investments to enhance its production capabilities, including constructing a new fabrication plant in South Korea and developing next-generation DRAM and high-bandwidth memory solutions. These efforts collaborate with TSMC to produce HBM4 chips and advanced packaging technologies, with mass production scheduled to begin in 2026.<\/span><\/p>\n Big news!\ud83c\udf89 Curious? Click the link below!https:\/\/t.co\/UgGvHS9NHp<\/a> pic.twitter.com\/rG4rHfsCUE<\/a><\/p>\n — SK hynix (@SKhynix) April 19, 2024<\/a><\/p><\/blockquote>\n\n
We're thrilled to announce an #MOU<\/a> between @TSMC and @SKhynix<\/a> for co-producing #HBM4<\/a> and enhancing packaging technologies.
This partnership aims to boost #AI<\/a> chip efficiency and provide tailored memory solutions.<\/p>\n